国家/地区 世界知识产权组织（3） 中国（2） 韩国（2） 美国（2）
IPC部 B（4） C（4） H（3）
IPC大类 B29（4） C08（4） C09（4）
H05（2）
IPC小类 B29C（4）
IPC B29C045/14（4）
发明人
公开年 2022（2）
申请年 2021（2） 
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Injection molding of surface portion for carbon fiber-reinforced thermoplastic composite, involves providing mold cavities, compounding fiber reinforced polyamide with acrylonitrile butadiene styrene and injecting polyurethane material.

BALTAZARYJIMENEZ A, ASTHANA S, KRULL B A

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E