国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） C09（3） H01（3）
H05（2）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Composition, useful to manufacture film used in transmissive electrode for organic electronic device, comprises, in solvent preparation, non-tubular graphene material, electrically conductive polymer including polythiophenes, and additive.

VIVILLE P, SOLOUKHIN V, KHOUSAKOUN E, DELIGNE N, COPPEE S, GRIVEI E, LAZZARONI R