国家/地区 中国（3）
IPC部 B（3）
IPC大类 C08（3） C09（3）
IPC小类 C08K（3）
IPC C08K003/04（3）
发明人
公开年 2021（2）
申请年 2021（3）
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Printing matte material used for preparing substrate with pattern of surface resistance type periodic meta-material, comprises inorganic binder, conductive material, polyurethane acrylic prepolymer, graft-modified acrylic monomer, organic microspheres, photoinitiator, leveling agent, and solvent.

CAI X, ZHENG M, LIN Z, FU X

Polishing pad for polishing corners of electronic display screen comprises e.g. base material layer whose inner wall is covered with skid-proof rubber layer and outer wall with hardening layer, and grid layer set to outer hardening layer.

LI J, TAN H