国家/地区 中国（3）
IPC部 C（3）
IPC大类 C09（3）
IPC小类 C09D（3）
IPC C09D007/61（3）
发明人 WANG H（3）
公开年 2022（2）
申请年 2021（3）
专利权人

Low dielectric and high heat conducting interface film comprises a substrate and a radiating layer comprised of organic polymer, boron nitride powder, silicon dioxide, bonding agent, reinforcing agent, dispersant, polyethylene wax and ethanol solution.

PAN F, LI H, ZHANG S, WU P, WANG H, LIAO X, YANG Y, REN Z

Inner covering film useful for inner layer of steel barrel, contains film-forming additive, anti-corrosion pigment filler, surfactant, coupling agent, curing agent, defoaming agent, leveling agent, corrosion inhibitor, and modified epoxy resin emulsion prepared using modified graphene oxide powder.

WANG H, QIN F, FAN L, ZOU L, ZOU Y, HU W

Micro-nano structure repairing type super-hydrophobic coating comprises nanostructure inorganic particles, film-forming substance and waxy substance and/or elastomeric polymer.

ZHU Y, WANG C, LIU Z, WANG H, ZHANG X