首页
论文数据库
SCI论文数据库
中文期刊数据库
硕博士论文数据库
专利库
专家库
企业库
产品库
登录
搜索
国家/地区
IPC部
C(2)
IPC大类
C01(2)
IPC小类
C01B(2)
IPC
C09D011/037(2)
发明人
公开年
2020(2)
申请年
2018(2)
专利权人
Forming electroplated copper on surface of non-metal materials by graphene-based plating ink involves preparing graphene-based plating ink, spraying plating ink on surface of non-metal material and drying ink sprayed on surface.
KU K, CHANG K, LAI C
Conductive ink used for flexible electronics and printed electronics, comprises thermoplastic urethane as binder, graphene nanoplatelets or graphene sheets, solvent which facilitates tuning of viscosity of ink, and surfactant.
GEDELA V, NUGURU R
上一页
当前第
1
页 共
2
条
下一页