国家/地区 中国（2）
IPC部 C（4） B（3）
IPC大类 C09（4） B05（2）
IPC小类 C09D（4）
IPC C09D177/00（4）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Processing hardware surface anticorrosion treatment, comprises e.g. mixing hydrochloric acid solution and pyrrole monomer to obtain solution A, mixing hydrochloric acid solution and ammonium peroxodisulfate to obtain solution B, mixing the solutions, filtering and drying to obtain polypyrrole powder.

GU S, LUAN J, DENG K

Forming multifunctional surface coating, involves providing substrate; providing barrier coating forming solution, applying barrier coating forming solution to surface of substrate; providing antimicrobial coating forming solution, applying, after predetermined time duration.

MCCONNELL D C, REXWINKLE I, MARTZ T, POTEET S, PIMENTEL K U

Polymer nanomaterial for repairing metal parts, includes hydroxyl-terminated epoxy resin, low-molecular polyamide, polyvinyl alcohol, curing agent, curing accelerator, modified filler, and metal powder.

LUO K