国家/地区 中国（3）
IPC部 B（4）
IPC大类 C09（4） B27（2）
IPC小类 C09D（4）
IPC C09J011/04（4）
发明人
公开年 2022（2） 2023（2）
申请年 2022（4）
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Heat-resistant and wear-resistant composite plate comprises high-temperature-resistant substrate, wear-resistant metal panel, heat-resistant adhesive layer and wear-resistant coating, heat-resistant adhesive layer includes heat-resistant adhesive layer compound.

ZHANG Y, RAN Y, XU J, DOU Q, ZU X

Preparing medium-density plate useful as e.g. backing board for printed circuit board drilling, comprises e.g. placing formaldehyde and methyl phenol into reactor, adding potassium hydroxide to reactant, mixing, heating, reacting, adding aminopropyltriethoxysilane, and reacting.

LI F

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X