国家/地区 世界知识产权组织（2）
IPC部 C（2）
IPC大类 C08（2）
IPC小类 C08K（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Heat dissipation composition used for forming coating agent, comprises base polymer containing silicone-based resin and filler containing at least two of expanded graphite, carbon nanotubes, graphene and metal nanoparticles.

HWANG I S, PARK Y S, HWANG I C, PARK K H, HWANGINSEONG, CHAN H, PARK K