国家/地区 韩国（2）
IPC部 C（2） H（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC C09J011/04（2）
发明人
公开年
申请年
专利权人

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Manufacture of electromagnetic-wave-absorption film for e.g. personal computer, involves coating organic-solvent dispersion liquid comprising graphene microparticles and binder resin on surface of plastic film, and drying coated film.

KAGAWA S, SEIJI K