国家/地区 世界知识产权组织（3） 中国（2） 韩国（2） 台湾（2）
IPC部 B（3）
IPC大类 B29（3）
IPC小类 C08J（3）
IPC C08J003/20（3）
发明人
公开年
申请年
专利权人

Composition for use in manufacture of in-mold electronic component, e.g. light emitting diode, comprises resin composition, and plastic composition.

CHAKI N K, SHAH C P, SINGH B, RAUT R, KAUSHIK V S, PANDHER R, NAGARAJAN N, KUMAR S M, RUSTOGI A, M S K, KAUSIK B, PANDER R, NAGARAZAN N, RUSTOGGI A

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Producing graphene based composite material used to e.g. manufacture composite product, by introducing graphene and polymeric composition with thermoplastic polymer into mixer, and melting polymer and mixture of molten polymer and graphene.

BEAUSOLEIL J, BORDERE S, DELPRAT P, GAILLARD P, KORZHENKO A