国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（6）
IPC小类 C09D（6）
IPC C09D179/08（6）
发明人
公开年 2017（2）
申请年
专利权人

Polyimide paint useful for high heat-resistant enameled wire for electronic appliances, household appliances and instrument equipment, comprises polyamic acid solution obtained by polycondensation of aromatic dianhydride, aromatic diamine and fluorinated amino graphene.

XU Z, LIU G, ZHU C, CAO H, ZHANG Q

Flexible heating film comprises conductive structure comprising carbon nanotubes and/or graphene, and polyimide backbone that is chemically linked to aminated conductive structure via anhydride bonds.

ZHENG T, ZHANG M, ZHANG Y, MAO O, ZUO B

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Preparing fluorinated graphene/polyimide enameled wire involves carrying out polymerization on diamine, dianhydride and fluorinated graphene, and soaking copper wire in synthesized fluorinated graphene/polyamic acid solution.

HE D, ZHANG B

Preparation of graphene modified polyimide composite film used in flexible circuit board, involves coating graphene-modified polyimide composite layer on surface of polyimide film.

MIN Y, WENG L, LIU Y, QI F, HE T

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN