国家/地区 中国（2）
IPC部 B（2）
IPC大类 B24（2）
IPC小类 B24D（2）
IPC B24D018/00（2）
发明人
公开年
申请年
专利权人

Preparing high abrasion resistance chemical mechanical polishing pad used for production of semiconductor chips, by mechanically dispersing filler and surfactant in organic solvent to obtain dispersion, adding resin solution to dispersion, stirring and coating on transparent film coiled material.

YAO L, CHEN H, XIANG H

Polishing pad for polishing corners of electronic display screen comprises e.g. base material layer whose inner wall is covered with skid-proof rubber layer and outer wall with hardening layer, and grid layer set to outer hardening layer.

LI J, TAN H