国家/地区 美国（2） 世界知识产权组织（2）
IPC部 B（3）
IPC大类 B29（3）
IPC小类 B29C（3）
IPC B33Y010/00（2） C09D011/101（2） C09D011/52（2）
发明人
公开年 2023（2）
申请年 2022（3）
专利权人

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Composition for use in three-dimensional printing of electronic devices, comprises at least triphenylamine which is used as a powder binding agent in the composition, where the composition is to be melted and extruded on a structure.

GLENN C M