国家/地区
IPC部 B（2）
IPC大类 C09（2）
IPC小类 C09D（2）
IPC
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Keyboard backlight module has main portion comprising light-shielding film, light guide film, light-reflecting film and forwarding packaging engine laminated in sequence, where light-shielding film, light-reflecting film and/or forwarding packaging engine are provided with thermally conductive layer.

DING J, FENG J, DING M