国家/地区 世界知识产权组织（3） 美国（2）
IPC部 B（4）
IPC大类 C09（4）
IPC小类 C09D（4）
IPC
发明人
公开年 2021（4）
申请年 2019（2）  2021（2） 
专利权人 HEWLETTPACKA.（2）

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Keyboard backlight module has main portion comprising light-shielding film, light guide film, light-reflecting film and forwarding packaging engine laminated in sequence, where light-shielding film, light-reflecting film and/or forwarding packaging engine are provided with thermally conductive layer.

DING J, FENG J, DING M

Flexible printed article used in wearable device e.g. conductive contact pad, comprises non-conductive, graphene oxide membrane base substrate, and electronic component positioned on non-conductive, graphene oxide membrane base substrate.

IONESCU R C, HOLDER H A, WITTKOPF J A, WORSLEY R, CASIRAGHI C, SHIELDS J P

Electrically conductive composition used for decorative or building underlayer material, comprises base material, fluid binder and interactive powder material having preset particle size and electrical resistivity.

BARDOU M