国家/地区 中国（3）
IPC部 C（3）
IPC大类 C08（3） C09（3）
IPC小类 C08L（3）
IPC C08L101/00（3）
发明人
公开年 2017（2）
申请年 2017（3）
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Preparation of expandable thermoplastic graphene porous carbon material, involves mixing elastic polymer matrix and coupling agent at high-temperature to obtain elastic polymer solution, and mixing graphene and dimethyl silicone oil.

SHAO G

Preparation of graphene-containing heat-shrinkable anticorrosive pipe, involves inspecting inner and outer surfaces of steel pipe which needs to be anticorrosive, transferring steel pipe to internal derusting machine, and shot blasting.

LIU H