国家/地区 中国（2）
IPC部 B（2）
IPC大类 B22（2）
IPC小类 B22F（2）
IPC C08K003/04（2）
发明人
公开年
申请年
专利权人

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Method for manufacturing carbon-metal composite, involves reacting composition with specific amount of graphene, providing carbon compound in composition, and providing carbon nanotube with carbon-metal composite.

GONG S Y, LEE S Y, CHOE H, LEE C, LI X, LI Z, CUI X, KONG X, GONG S