国家/地区 中国（7）
IPC部 B（7）
IPC大类 C21（7） C22（7） B22（5）
B21（4） H01（4）
IPC小类 C21D（7）
IPC C22F001/08（7）
发明人
公开年 2021（6）
申请年 2021（7）
专利权人

In-situ interface modification method of graphene copper-based composite material involves adding copper powder after annealing and reduction into mixed solution of carbon source and copper salt in oil bath heating environment, and coating carbon source with copper ion powder.

ZHANG D, LI Z, PENG Y, DONG Z, XIONG D

Method for preparing high-strength and high-conductivity copper/graphene composite material, involves conducting electrical and thermal conductivity, tensile properties and other tests on rolled clad sheet and heat-treated clad sheet, and comparing and observing microstructures.

YI Y, WANG G, ZHANG S, YU H, ZHANG X, JIANG Q

Ultra-low chromium content copper tungsten-copper chromium integral electrical contact comprises copper tungsten arc resistant end and copper chromium conductive end.

LIU P, YANG R, ZHOU N, ZHAO J, KANG D, ZHOU X

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparation of copper based iron based composite electrical contact material includes preparing graphene fiber containing ferric oxide powder, modifying graphene fiber containing ferric oxide powder and pretreating base material.

ZHENG Y

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

High-strength alloy plate comprises nickel, silicon, molybdenum, lithium, magnesium, yttrium, platinum, rhenium, bismuth, tellurium, zirconium, and copper.

GE P, GUO D, HE W