国家/地区 中国（3）
IPC部 C（3）
IPC大类 C21（3） C22（3） B21（2）
B22（2）
IPC小类 C21D（3）
IPC C22C001/02（3）
发明人
公开年 2021（3）
申请年 2021（3） 
专利权人

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

High-conductivity copper alloy plate comprises silver, nickel, tungsten, phosphorus, tantalum, antimony, hafnium, holmium, graphene-coated nano aluminum powder, tin, boron, manganese, cesium, calcium, scandium, and nano copper powder.

GE P, HE W, GUO D