国家/地区 中国（2）
IPC部 C（2）
IPC大类 C01（2）
IPC小类 C01B（2）
IPC C01B032/184（2）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing nitrogen-doped graphene comprises taking ionic liquid as precursor, spin-coating ionic liquid on the annealed copper foil in argon/hydrogen atmosphere and preparing nitrogen-doped graphene by high-temperature thermal decomposition.

GUAN S, WANG X, LI S, PENG Y