国家/地区 中国（4）
IPC部 B（4）
IPC大类 C21（4） C22（4） B22（3）
B21（2） H01（2）
IPC小类 C21D（4）
IPC C22C001/10（4）
发明人
公开年 2021（4）
申请年 2020（2）  2021（2） 
专利权人

Graphene bonded silver wire for packaging, comprises specified amount of graphene and silver.

PENG X, PENG S

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

High-conductivity and heat-resistant rare earth aluminum alloy wire comprises magnesium, iron, boron, tellurium, niobium, rare earth element, graphene, and aluminum and unavoidable impurities.

WANG M, XIONG C

Preparing high-damping copper-aluminum-manganese shape memory alloy, involves crushing copper zirconium compound inoculant ingot, mixing inoculant particles with multi-layer graphene, ball milling, drying composite powder, and solidifying.

WANG Q, JIAO Z, YIN F, ZHANG J, LIU L, JI P, YAO C