国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D005/18（2）
发明人
公开年 2022（2）
申请年 2021（2）
专利权人

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.

ZHENG Q, LI X