国家/地区
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D005/00（2）
发明人
公开年 2023（2）
申请年 2021（2）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Strain measurement sensor used for wearable device to measure biosignal or movement, comprises base layer formed of flexible material, and conductive thin film layer provided on surface of base layer and formed with cracks having at least one pattern of irregular straight lines or irregular curves.

KIM H J, RYU C H, KIM H, RYU C