国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 LEI W（2）
公开年 2022（2）
申请年 2022（2）
专利权人 UNIV JIANGSU TECHNOLOGY（2）

Array through hole electroforming processing device, has workpiece unit that is installed between upper clamp structure and lower clamp structure, and electroforming liquid that enters flow channel of upper clamp structure from incoming liquid.

WAN X, HAN J, YE X, LEI W, TAN J, HE B

Graphene quantum dot composite plating solution for electroplating copper sheet, comprises graphene quantum dots, nickel sulfate, nickel chloride, boric acid, organic additives and water-soluble nonionic surfactant.

CHEN N, LI Y, LI Z, LEI W