国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC
发明人 WANG X（2）
公开年 2023（2）
申请年 2022（2）
专利权人

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Preparing nano-copper/graphene composite coating using pulse brush plating technology comprises e.g. sensitizing the graphene surface, preparing the suspension, adding surfactant, performing electroless copper plating, ultrasonically stirring, and adopting brush plating solution to prepare coating.

WANG J, QIAO Y, WANG X, LIU S, ZOU Y, ZHAO G