国家/地区 中国（3）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC
发明人 LI W（3）
公开年 2023（2）
申请年 2022（3）
专利权人

Porous metal type conductive adhesive film, comprises upper adhesive layer, ultra-thin porous metal layer and lower adhesive layer, and ultra-thin porous metal layer formed between upper adhesive layer and lower adhesive layer.

LI J, LIN Z, GAO J, WANG Y, LI W

Preparing resin-based composite material filled with high heat-conducting three-dimensional framework foam useful in displaycard radiating, comprises e.g. copolymerizing three-dimensional framework foam after electro-deposition by resin system by liquid-phase vacuum dipping, solidifying and forming.

LI W, ZHAO Y, WU X, YAN K, XU K, SHI S, WANG Y, JIANG T

High-corrosion-resistance composite electroplating electrolyte used in e.g. preparing coating comprises zinc salt, nickel salt, ammonium salt, potassium salt, complexing agent, buffer, corrosion-resistant component, and surfactant.

LI W, ZHU S, HAN G, WANG X, ZHAO Y, CAO L, YANG Y, ZHANG P, WANG Q