国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D007/06（2）
发明人 WANG J（2）
公开年
申请年
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Preparing antibacterial and corrosion resistant metal orthodontic appliance, involves polishing metal appliance, mixing graphene oxide and nano-silver particles, and adding pretreated metal appliance into electrodeposition solution.

ZHANG C, HE L, DAI D, CHEN Y, WANG J