国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D003/38（2）
发明人 ZHANG L（2）
公开年 2022（2）
申请年 2021（2）
专利权人

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Processing uniform electroplating of inorganic non-metal base material useful in e.g. electronic device, comprises e.g. adding high-conductivity activated plating solution with circulating filtration system, placing substrate on annular cathode fixing frame, and plating.

ZHENG X, JIANG Z, ZHANG L