国家/地区 中国（4）
IPC部 B（4）
IPC大类 B05（4） C25（4） C09（2）
IPC小类 B05D（4）
IPC B05D001/02（4）
发明人
公开年 2023（2）
申请年 2021（2） 
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Teflon coating spray liquid useful for non-stick pan comprises bottom layer (e.g. tetrafluoroethylene, modified graphene oxide, sodium hyposulfite, modified thermochromic pigment, silicon carbide whiskers and water) and surface layer.

CHEN C