国家/地区 中国（3）
IPC部 B（3）
IPC大类 B05（3） C25（3）
IPC小类 B05D（3）
IPC B05D003/02（3）
发明人
公开年
申请年 2021（3）
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z