国家/地区 中国（4）
IPC部 B（4）
IPC大类 B05（4） C25（4）
IPC小类 B05D（4）
IPC B05D007/24（4）
发明人
公开年 2021（4）
申请年 2020（3） 
专利权人

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Acrylonitrile-butadiene-styrene engineering plastic surface metal layer comprises antioxidation layer containing conductive filler, reducing filler and aqueous acrylic resin emulsion, semi-light nickel layer, and anticorrosive layer.

FANG J, XIONG Z, CHENG G

Teflon coating spray liquid useful for non-stick pan comprises bottom layer (e.g. tetrafluoroethylene, modified graphene oxide, sodium hyposulfite, modified thermochromic pigment, silicon carbide whiskers and water) and surface layer.

CHEN C