国家/地区 中国（3） 世界知识产权组织（2）
IPC部 C（3）
IPC大类 C08（3） C25（3）
IPC小类 C08J（3）
IPC C08L063/00（3）
发明人
公开年 2021（3）
申请年 2020（3）
专利权人

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Continuous electrophoretic deposition modified carbon fiber reinforced multi-matrix composite material comprises carbon fiber, inorganic powder including graphene powder, aluminum oxide powder and/or zirconium oxide powder, and substrate.

CHEN Z, LIAO J

Electrophoretic deposition-electropolymerization combined to modify carbon fiber comprises e.g. adopting electrophoretic deposition method to deposit graphene oxide on surface of carbon fiber, obtaining graphene oxide coated carbon fiber.

ZOU H, SUN T, LIANG M, CHEN Y, ZHANG X, LI M