国家/地区 中国（2）
IPC部 C（2）
IPC大类 C21（2）
IPC小类 C21D（2）
IPC C21D001/26（2）
发明人
公开年 2021（2）
申请年 2021（2）
专利权人

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparing graphene high-temperature heating aluminum plate comprises e.g. preparing graphene ink, printing graphene ink on the substrate aluminum plate, performing annealing and encapsulating the graphene surface using insulating material.

WANG Z, LI T, YIN J