国家/地区 韩国（2）
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C25D001/04（2）
发明人
公开年
申请年
专利权人

Substrate for electro-forming plating e.g. metal key pad, has graphene layer which is formed on surface of conductive substrate.

LEE S H, RHO H K, KIM T W, BAE S K, SON D I

Copper foil used in manufacture of graphene, has preset surface roughness, and contains copper plating layer and/or copper sputter layer.

KOHIKI MICHIYA, SAKAGUCHI KAZUHIKO, KOHIKI M, SAKAGUCHI K, MICHISHITA N