国家/地区 中国（2）
IPC部 C（2）
IPC大类 C25（2）
IPC小类 C25D（2）
IPC C25D001/10（2）
发明人
公开年
申请年 2022（2）
专利权人

Method for preparing composite mask plate in electronic device processing field, involves setting photo-etching pattern on mask plate, removing part of photoresist, removing remaining photoresist with cleaning solution, cleaning laser opening residue, and drying mask plate to finish preparation.

CAI J, JIANG C, ZHUANG M, WU J, ZHAO W, YAO Q

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C