国家/地区
IPC部 C（2）
IPC大类 C23（2）
IPC小类 C25D（2）
IPC C25D003/38（2）
发明人
公开年 2019（2）
申请年
专利权人

Graphene-containing PCB copper composite plating solution includes a copper ion source, where the copper ion source is preferably copper chloride, copper sulfate, the content of the copper ion source is 55-95g/L, sulfuric acid is preferred.

LI A

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z