国家/地区 中国（2）
IPC部 B（2） C（2）
IPC大类 B23（2）
IPC小类 C25D（2）
IPC C25D005/48（2）
发明人
公开年
申请年
专利权人

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Processing tinned copper-clad alloy wire involves preparing alloy rod, welding copper and alloy wire to form copper-clad alloy wire blank, carrying out multiple times of small deformation drawing processing, and plating tin layer.

OUYANG Y