国家/地区 中国（2） 美国（2）
IPC部 B（5）
IPC大类 B05（5）
IPC小类 B05D（5）
IPC C25D005/54（5）
发明人 JANG B Z（2） JHONG Y（2） LEE S（2）
LIN Y（2） ZHAMU A（2）
公开年 2019（2）
申请年 2018（4） 
专利权人 NANOTEK INST.（2）

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Making electroplated copper on non-metal material surface by graphene-based plating ink involves drying the ink sprayed on non-metal material surface, immersing in plating solution and applying voltage or current to get electroplated copper.

KU K, CHANG K, LAI C P

Producing surface-metalized polymer film involves preparing graphene dispersion comprising multiple graphene sheets and optional conducive filler dispersed in first liquid medium, which is adhesive monomer or oligomer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Apparatus for manufacturing a surface-metalized polymer film comprises film feeder roller that feeds continuous polymer film, graphene deposition chamber that receives continuous polymer film from film feeder roller.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z

Graphene metal solution useful as backing conductive layer for metallization of non-metallic surfaces, comprises graphene or graphene oxide, film forming agent, dispersing agent, anionic surfactant, pH adjuster and water.

CHEN W