国家/地区 美国（3）
IPC部 C（3）
IPC大类 C23（3）
IPC小类 C23C（3）
IPC C23C018/20（3）
发明人
公开年
申请年
专利权人

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M

Surface-metalized polymer article comprises polymer component, first layer composed of multiple graphene sheets and conducive filler coated on polymer component surface, and second layer of plated metal deposited on first layer.

LIN Y, LEE S, JHONG Y, ZHAMU A, JANG B Z, LI S

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J