国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） C23（2）
IPC小类 C25D（5）
IPC C25D021/12（5）
发明人
公开年 2022（3） 2023（2）
申请年 2022（5）
专利权人

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Processing titanium-based nano composite anode for zinc electrodeposition, comprises soaking acidic-etching titanium plate in modified multi-walled carbon nanotubes suspension, reacting, preparing -lead dioxide layer titanium base electrode, cleaning and drying.

LI H, ZHAO C, FENG Z, ZHANG Q, FENG F

Preparing nickel-graphene super-hydrophobic coating, comprises using metal substrate as cathode and nickel as anode, electroplating in plating solution, vacuum drying, obtaining nickel-graphene super-hydrophobic coating on surface of metal substrate.

YANG C, LI Z, WANG A, XING X, ZHANG R, LIU J, CUI G

Preparation method of carbon material used in e.g. micro-circuit, involves obtaining carbon material on surface substrate when conductive medium is solid substrate.

DONG Q, BAI W, CHU D, HE Y