国家/地区 美国（2）
IPC部 B（2）
IPC大类 C23（2） C25（2）
IPC小类 C23C（2）
IPC C25D011/02（2）
发明人 WU K（2）
公开年
申请年
专利权人 HEWLETTPACKARD DEV CO LP（2）

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Multi-layered sheet for use as housing for electronic devices, has graphene-based barrier coating that includes specified amount of graphene and is formed on micro-arc oxidized layers and has prescribed thickness.

WU K, CHANG C, CHEN W