国家/地区 美国（3）
IPC部 B（3）
IPC大类 C25（3） C23（2）
IPC小类 C25D（3）
IPC C25D011/02（3）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Forming adhesively bonded structure used as building infrastructures, by applying primer compound comprising functionalized nanomaterial dopant to substrate, drying primer compound on substrate, applying adhesive compound over primer layer, contacting adhesive layer with substrate, and curing.

SMITH B A, POTEET S A, PUJAR V V

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L