国家/地区 美国（2）
IPC部 B（2）
IPC大类 B29（2）
IPC小类 B29C（2）
IPC
发明人
公开年
申请年
专利权人

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Composite film used for packaging organic light emitting diode comprises base film, polydiallyldimethylammonium chloride layer, graphene oxide layer and self-assembling mono-molecular layer.

FENG X, LIU J, QIU Y, WEI X