国家/地区 中国（2）
IPC部 B（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C016/26（2）
发明人
公开年 2021（2）
申请年 2021（2） 
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H