国家/地区
IPC部 B（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C23C028/04（2）
发明人
公开年
申请年
专利权人

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y