国家/地区 中国（3）
IPC部 C（4）
IPC大类 C25（4）
IPC小类 C25D（4）
IPC C25D007/06（4）
发明人
公开年 2023（4）
申请年 2022（4）
专利权人

Porous metal type conductive adhesive film, comprises upper adhesive layer, ultra-thin porous metal layer and lower adhesive layer, and ultra-thin porous metal layer formed between upper adhesive layer and lower adhesive layer.

LI J, LIN Z, GAO J, WANG Y, LI W

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

High-strength steel plate comprises base steel plate, and ferrite layer having internal oxide layer on which iron-nickel alloy layer is formed with excellent surface quality formed in internal oxide layer from surface of ferrite layer.

LEE K, LEE C, KANG K, KIM N, JANG Y, LEE J, KANG K C, KIMNAMAH, JANG Y M