国家/地区 中国（5）
IPC部 C（5） H（2）
IPC大类 C25（5） C23（3） H01（2）
IPC小类 C25D（5）
IPC C25D007/06（5）
发明人 LI J（2）
公开年 2023（5）
申请年 2022（3）  2023（2） 
专利权人

Porous metal type conductive adhesive film, comprises upper adhesive layer, ultra-thin porous metal layer and lower adhesive layer, and ultra-thin porous metal layer formed between upper adhesive layer and lower adhesive layer.

LI J, LIN Z, GAO J, WANG Y, LI W

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Lithium-carbon composite belt, comprises conductive substrate, metal lithium transition layer on at least one side of substrate, and lithium-carbon composite material layer positioned outside metal transition layer.

WANG W, SUN Z, HUAN Q, MU H, CHEN Q, KONG D

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Preparing battery steel case coated with metal layer on the surface, comprises e.g. grinding surface of low-carbon steel strip, performing electroplating in nickel-iron plating solution, surface magnetron sputtering of cobalt, and electroplating in nickel-iron-cobalt-phosphorus plating solution.

LI J, ZHOU H