国家/地区 中国（2）
IPC部 C（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D021/12（3）
发明人
公开年 2023（3）
申请年 2022（3）
专利权人

Application of metal to substrate used for metal plating of objects and materials, e.g. pipes, industrial valves, and household items involves contacting substrate with aqueous metal plating composition comprising polyammonium bisulfate.

TRAN N, HATTEN J A, BOWMAN R H, KEISER J A, HAMMOND D, SINGLETON F L, NICHOLAS D

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B