国家/地区
IPC部 B（2） C（2）
IPC大类 C23（2）
IPC小类 C23C（2）
IPC C25D007/00（2）
发明人
公开年 2023（2）
申请年 2022（2） 
专利权人

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z