国家/地区 中国（3）
IPC部 B（3）
IPC大类 C25（3）
IPC小类 C25D（3）
IPC C25D005/18（3）
发明人
公开年 2021（3）
申请年 2021（3） 
专利权人

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Preparing double-pulse electroplating nickel-graphene composite plating layer of continuous casting crystallizer comprises processing crystallizer copper plate before electroplating, and preparing graphene oxide solution by Hummers method.

FENG T